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The New Glass Company
is pleased to accept production orders, so that if you
indicate the glass materials needed, and the composition,
particle size, and production requirements, we will
be happy to respond in precise detail to your request.
If you let us know any difficulties you are having in
regard to specifications and glass uses, we would be
happy to propose a plan that will meet your needs. Please
feel free to discuss your situation with us and let
us know what we can do for you. |
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Powdered glass
suited for back-side dielectric layer (white
back), Rib, and Front-side dielectric layer
(TOG) |
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The glass used is PbO-SiO2-B2O3,
Bi2O3-SiO2-B2O3
glass which has a softening temperature
of approximately 550ºC, and a thermal
expansion coefficient of around 70 x 10
-7/ ºC |
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It is used in products
such as PDP (Plasma Display Panel) and the
next generation of thin displays. |
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Powdered glass
with low dielectric loss and a low dielectric
constant, suited for modules and chip inductors
that can be fired at less than 900 ºC. |
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We are using unleaded glass
ceramics that uses SiO2-B2O3-R2O, SiO2-B2O3-RO-R2O
glass with a glass transfer point of 500-700
ºC and a thermal expansion coefficient
of around 40-60 x 10-7 / ºC |
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It is used in products
such as cell phones, PDAs, and electronic
components used in various wireless communication
devices |
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Mainly powdered
glass and glass paste used in glaze layers
of alumina substrate for thermal heads |
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The glass
used is SiO2-Al2O3-RO, an unleaded, non-alkaline
glass which has a softening temperature
of approximately 850-900 ºC, and a thermal
expansion coefficient of around 70 x 10-7
/ ºC |
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It is used in products
such as fax machines and printers for digital
cameras. |
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Powdered
glass, glass paste, glass rings, and glass
rods used for the sealing and adhesion
of metals, alumina, glass, and silicon |
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Using PbO-B2O3, Bi2O3-B2O3
glass with a softening temperature of approximately
350~500deg C, our line-up of sealing materials
conforms to the thermal coefficient for
basic materials. |
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Used in products such
as electronic components (ex. laser diodes,
crystal oscillator packaging) and stainless
thermos bottles |
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Powdered
glass added to decrease the sintering temperature
of various ceramics and metal powder |
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We offer
a line-up of PbO-B2O3-SiO2, Bi2O3-B2O3-SiO2, B2O3-ZnO,SiO2-B2O3-R2O,SiO2-B2O3-RO glasses
for use as binder agents. |
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Used in products such
as electronic parts and material (ex. ceramic
capacitor, conductor) |
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Glass paste
and powder used for HIC and over-coating
for chip resistance |
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Glass paste
and powder for alumina, metal, and ceramic
insulation layers |
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Used in various electronic
components and materials and in IH cooking
utensils |
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Technology
to develop lead free glass composites
with low-melting temperature |
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Pulverization
processing technology that controls
the average, minimum, and maximum
diameters of powder particles |
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Built-up
technologies with sol-glass |
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Technology
for processing highly spherical micro-beads |
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